Product features and advantages

FZPI series is a polyamide acid resin solution that can be cured at low temperature. After curing into film, it has excellent heat resistance, mechanical, insulating/dielectric properties, and it has good bonding properties to AlN/SiN/Copper/Nickel and other substrates;

The FZPI series has excellent storage stability.

Application

This material is mainly used in 300 mm wafers and new SiC packaging systems, occupying most of the market in the field of chip packaging. It is one of the best packaging and coating materials in the field of semiconductor and microelectronic information at present.